Process Capabilities

 

IC Processing

 

MEMS Processing

  • Epitaxy
  • Oxidation 
  • Photolithography
  • Ion Implant
  • Diffusion / Anneal 
  • Sputtering / Evaporation               
  • LPCVD / PECVD
  • Thin Film Deposition
  • Bulk Anisotropic Etch 
  • Bulk Isotropic Etch
  • Surface Micromachining          
  • SIMOX / BESOI
  • Silicon DRIE
  • LIGA / SLIGA
  • Micromolding 
  • Microstamping 
  • Anodic Bonding
  • Wafer Bonding 
  • Plating
  • Polymers / Elastomers
  • Piezoelectric Thin Films
  • Ultra-Thin Lap/Polish of Si and Glass